TDK Ventures has invested in NovoLINC, a leading company in thermal interface materials, to enhance cooling solutions in energy-consuming data centers amid rising demands from AI technologies.
Target Information
In the summer of 2024, TDK Ventures identified NovoLINC as a leading innovator in the field of thermal interface materials (TIMs). Based in Pittsburgh, PA, NovoLINC is at the forefront of developing advanced solutions designed to improve the heat transfer process in high-performance computing and data centers, where cooling efficiency is increasingly paramount. The company's focus is on creating scalable, cost-effective TIMs that meet the critical needs of the emerging liquid cooling market.
With an expert team in materials science and heat transfer, NovoLINC addresses the challenges posed by rising energy consumption in data centers and the need for efficient cooling solutions. Their thermal management technology is built upon a unique architecture featuring vertically aligned copper nanostructures that greatly enhance thermal conductivity and reduce thermal resistance, which is particularly crucial as data centers transition from air to liquid cooling systems.
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Industry Overview
The data center industry in the United States is witnessing a significant surge in energy consumption, projected to increase by up to 10% in the coming years and potentially double over the next decade. This growth is driven by the acceleration of cloud compu
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TDK Ventures
invested in
NovoLINC
in 2024
in a Other VC deal