NovoLINC, a thermal technology startup from Carnegie Mellon University, secured seed funding from M Ventures, Foothill Ventures, and TDK Ventures to innovate advanced cooling solutions for the growing semiconductor and AI data center industries.

Information on the Target

NovoLINC is an innovative thermal technology startup that has emerged from Carnegie Mellon University. The company has recently secured seed funding led by M Ventures, along with contributions from Foothill Ventures and TDK Ventures. NovoLINC specializes in advanced nanocomposite thermal solutions designed to minimize thermal resistance to an industry-leading low of less than 1mm²-K/W. Under the leadership of co-founders Prof. Sheng Shen and CTO Dr. Rui Cheng, the company has also received significant grant funding from prestigious U.S. organizations, including the National Science Foundation's Partnerships for Innovation and ARPA-E's COOLERCHIPS Programs.

Industry Overview in the Target’s Specific Country

The semiconductor industry in the United States has been facing significant challenges due to the surging power requirements of electronic chipsets, particularly with the advent of technologies such as artificial intelligence. Over the past decade, power consumption metrics for high-performance components, like NVIDIA GPUs, have markedly increased, with consumption levels rising from approximately 250W to 1,200W for flagship models. Similarly, leading CPU manufacturers like Intel and AMD have experienced a near threefold increase in power consumption from 2019 to 2024.

Despite these skyrocketing demands, advancements in thermal interface solutions have failed to keep pace, creating a bottleneck that hampers efficient cooling and effect