ChEmpower has secured $18.7 million in Series A funding to enhance its abrasive-free planarization technology for semiconductor manufacturing, addressing sustainability and performance demands in the chip industry.
Information on the Target
ChEmpower Corporation, based in Portland, Oregon, is a pioneering semiconductor materials company focused on supplying polish pads and chemical solutions for planarization processes in advanced chip manufacturing. The company has developed an innovative abrasive-free planarization technology that significantly enhances the production of defect-free surfaces. This technology not only improves chip yield but also boosts performance, offering a sustainable alternative to traditional chemical mechanical planarization (CMP) methods, which often lead to surface damage and lower manufacturing efficiency.
ChEmpower has achieved significant milestones since its inception, including the demonstration of its abrasive-free 300mm copper process and the establishment of a pilot production line for its pads. The company has forged strategic partnerships with leading semiconductor firms, reflecting a growing interest from customers at the forefront of technology.
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Industry Overview in the Target’s Specific Country
The semiconductor industry in the United States is currently experiencing unprecedented growth, primarily driven by the soaring demand for AI and high-performance computing chips. As the technology landscape evolves, manufacturers are facing increased co
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invested in
ChEmpower
in 2025
in a Series A deal
Disclosed details
Transaction Size: $19M